Do the supplies use magnifying glass to full check PCB solder connections?
供应商是否用放大镜全面检查PCB的焊点?
The results show the strength and the dimension of spot the requirements.
试验结果表明,焊点强度满足要求,熔核尺寸符合要求.
Nitrogen protection can improves wettability of lead - free solder and solder joint quality.
氮气保护可以改善无铅钎料的润湿性,提高焊点质量.
The joints heat up as a result of the Joule heating effect.
焦耳热效应造成焊点温度提高.
The failure location and fracture mechanism under bending load are discussed.
讨论了弯曲应力下焊点的失效位置和断裂机理.
The welding technic on the rectifier diode connection for improving reliability.
元件板二极管的焊点采用熔焊技术,增加可靠性.
Desirable for high - performance Ball Grid Array ( BGA ) package .
高性能球形焊点阵列封装需要 倒装焊.
Block incoming electrical solder joints with different samples!
来料电机座的焊点与样品不同!
Feature: Wide suitability, firm welding spot , easy operation, stable function, safety & stability and so on.
特点: 该机具有适应范围广 、 焊点 牢固 、 操作方便 、 性能稳定 、 安全可靠等优点.
Interface void damage is the failure characteristic of solder joint under temperature cycling.
温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.
The X - Y table aquires the accuracy 5 μ m to ensure the exact positions of bonder spots.
X -Y工作台要求实现精度达5μm,以便保证各焊点的精确位置.
Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint.
皂化剂中所含成分, 若不采用适当的抑制剂, 将会侵蚀金属表面, 造成焊点钝化.
Using the machine to cut can minimize stress occurrence and prevent welding point crack.
以机器分割,减少应力发生,防止焊点龟裂.
Are outputted boards at least sample inspected pre reflow for placement, missing components, and solder defects?
回流焊输出之板是否至少抽样检查板的置件精度, 有无少件和不良焊点?
As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects.
随着热循环周数的增加, 焊点中出现疲劳裂纹.