The invention uses cheap, clean silicon powder as raw material, the product looks like one dimensional, easy to strength ceramic toughness.
本发明方法使用廉价环保的硅粉为原料,所得产物形貌是一维的,易于加强陶瓷的韧性。The surface morphology after preferential corrosion along the vertical orientation was observed via an optical microscope.
用光学显微镜观测和分析电火花线切割硅表面沿纵向分层择优腐蚀后的形貌;The surface topography of PCB manifests self similarity, which shows that the material fracture possesses fractal characteristics.
电路板外观形貌具有自相似性,表现出分形的特征。The microstructure and thermal physical properties of the surface reaction al layer determine the range of strength improvement.
材料表面反应物层的微观形貌及热物理性能决定了材料抗弯强度的提高幅度。Thirdly, the surface morphologies of the deposits prepared by different electroforming methods were analyzed.
第三,分析了不同电铸方式制备的沉积层表面形貌。The surface morphology of the films were observed by Scan Electron Microscope (SEM) and Atom Force Microscope (AFM) respectively.
用扫描电镜、原子力显微镜观测了非连续多层膜的表面形貌。Thus, testing the surface profile in vacuum or environmental chambers is of significance.
因而,在真空或特定气氛下进行表面形貌测试具有重要的意义。The surface structure, adhesion, chemical durability and visible-infrared spectra of the films were studied.
研究了所得硅膜的表面形貌、附着力和化学稳定性及其红外-可见光谱特性。The surface topography of viscoses changed obviously, and the grooves disappeared gradually as the degree of crosslinking increasing.
随着交联程度的增加,纤维的表面形貌变化比较明显,黏胶纤维表面的凹槽逐渐消失。